Hello IBM Community!
I'm participating in the IBM TechXchange 2025 Hackathon and I’d appreciate your guidance on a compliance question related to hardware preparation.
For my project, I supervised the creation of a custom PCB designed specifically for this hackathon. I worked with a professional engineer who executed the design based on my specifications, and I paid for the service to ensure full ownership of the work. The board is being assembled and soldered by JLCPCB before August 1st (but I will receive the PCB on the 1 or 2nd of August), purely for logistical reasons (manufacturing and delivery times would have made it impossible to begin development on time).
Important details:
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The PCB was created exclusively for this hackathon, and I directed the technical concept and sensor layout.
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No testing, activation, coding, or integration will occur before August 1.
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The board remains a passive component until development begins during the official hackathon period.
I understand the rule that “building any part of your proof-of-concept ahead of the hack is not allowed”, and I want to confirm whether this preparation method is considered compliant.
Thanks in advance for your insights 🙏