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Cadence Supercharges EDA Workloads with IBM Cloud High-Performance Computing
At the forefront of semiconductor innovation, Cadence is pushing the boundaries of electronic design automation (EDA) to meet the demands of next-gen AI, autonomous systems, and advanced chip design at the 2nm node and beyond. To enable the massive computational workloads required for precision chip development, Cadence has deepened its partnership with IBM—leveraging a hybrid cloud infrastructure built on IBM Cloud Bare Metal Servers, Virtual Servers for VPC, IBM Spectrum LSF, and IBM Storage Scale.
By integrating IBM’s high-performance, secure cloud capabilities into its EDA pipeline, Cadence is accelerating time-to-market, improving workload elasticity, and ensuring end-to-end system verification at unprecedented scale. IBM Cloud HPC enables Cadence to manage millions of jobs monthly across 10,000+ engineers, while supporting terabytes of data movement and compute bursts with zero disruption.
With the Cadence OnCloud platform powered by IBM, even the most complex silicon tapeouts and AI-driven design workflows can be executed with agility, scalability, and cost-efficiency—bringing new silicon to market faster, smarter, and more securely.