DAC 2019: Design on Cloud pavilion

DAC 2019: Design on Cloud pavilion 

Tue September 10, 2019 04:19 PM

IBM presentation from the design on cloud pavilion at DAC 2019

Title: Empowering the EDA designer
Speaker: Leon Stok, Vice President, Electronic Design Automation, IBM Systems
Abstract: Modern hybrid cloud offerings allow users instant access to enormous amount of data. Why can't we give chip designers instant access to all their chip data and empower them to ask any complex query about their design? Hybrid cloud, micro-services based architectures, such as IBM Cloud Private for cloud-native workloads combined with IBM Spectrum LSF for managing HPC workloads can help to make this a reality. By bridging HPC and cloud-native workloads on a common infrastructure, organizations can blend performance with the agility to lift and shift EDA workflows and transform them into a services architecture. At IBM we have observed significant improvement in EDA productivity by providing the design teams of complex microprocessors rapid access to all of the data which large hierarchical designs are comprised of. Now designers can formulate just about any question regarding the design and obtain the results promptly.


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